Tofu Pad - A Refined Desk Companion
Uncompromised Efficiency: The 2026 launch marks the arrival of our optimized ultra-low power Bluetooth architecture, drastically reducing the need for frequent charging.
Pure Minimalism: Designed to be truly wireless, the Tofu PAD removes necessary cables from your desk mat, aligning perfectly with the Tofu series' signature clean aesthetic.
Signature Customization: Following the standards set by our Tofu60, 65 3.0, and TKL models, the PAD is available in a variety of premium materials and colors to match your unique preference.
| Kit |
Top Case Colour |
Bottom Case Colour |
Weight |
PCB |
Plate
|
| Kit 1 |
E-Coating U9 |
E-Coating U9 |
Copper Coloured Aluminium |
Dual Mode Hotswap |
Anodised ALU Black |
| Kit 2 |
Anodised Black |
Anodised Black |
Copper Coloured Aluminium |
Dual Mode Hotswap |
Anodised ALU Black |
| Kit 3 |
E-White |
E-White |
Copper Coloured Aluminium |
Dual Mode Hotswap |
PC |
| Kit 4 |
Anodised Silver |
Anodised Silver with textures |
Copper Coloured Aluminium |
Dual Mode Hotswap |
PC |
Case Design
Craftsmanship & Finish
Expertly crafted, the Tofu PAD case comes in two premium finishes. Choose the silky-smooth feel of sandblasted anodized aluminum or the fine, matte texture of our rich E-coating. Both perfectly highlight the case's clean, sculpted lines.
Structural Integrity
Internally, the Tofu PAD carries forward the minimalist design heritage of the TOFU family while introducing a versatile dual-mounting system. This allows users to choose between a classic TOP Mount for a firm, responsive feel, or a PCB Gasket Mount for a softer, more flexible typing experience, catering to diverse preferences.
Visual Language
Visually, the Tofu PAD introduces a bold design language. The bottom case features an exposed rear accent, splitting the USB port face into two distinct sections. This innovative construction enables striking two-tone color combinations, making it both immediately captivating and enduringly timeless.
Integrated Force Break System
The design includes custom-molded Force Break silicone pads. These pads create a buffer between case components, effectively dampening case vibration and eliminating unwanted metallic "ping," ensuring a cleaner sound profile.
Mounting Style:
PCB Gasket Mount
Engineered for Softness
Following a similar support distribution as the TOP Mount, the PCB Gasket is designed to provide a maximally soft, bouncy, and flexible typing experience.
Plateless Build Potential
Combine this mount with the solderable PCB to assemble your board without a plate. This "plateless" configuration is the ultimate choice for achieving maximum flex and a unique, deep sound profile.
Top Mount
Optimized TOP Mount Structure
To minimize resonance and hollowness, the mounting points for the TOP structure are strategically placed to avoid the spacebar area. This results in a more uniform and satisfying sound signature.
Top Case Mount Silicone Dampeners
Silicone dampeners provide complete physical decoupling of the positioning plate from the upper housing. This design mitigates resonance conduction at its origin, significantly reducing structural noise. Top case mount method is easier to install.
Force Break Mod
Includes 4 Teflon pads to decouple case sections, effectively killing resonance and metallic ping at the source.
Exploded View
Keyboard Parts:
Top Case Colours
Bottom Case Colours
Weight Bar:
Copper
ALU with Anodised Copper
Plate Options:
- Anodised ALU Black
- PC
- FR4
- Carbon Fibre
PCB Options:
Wired PCB (Solder & Hot-Swap)
Dive into deep customization with support for AVA, VIAL, and VIA. The solder version also allows for a unique plateless build option.
- 1.6mm thickness
- FR4 material
- Solder version/ Hotswap version
- Magnetic connector PCB
Dual-Mode PCB
Experience the freedom of wireless with our first-ever dual-mode board powered by ZMK. Its ultra-low power consumption delivers an incredible 6+ months of battery life from a single 1000mAh battery.
- 1.6mm thickness
- FR4 material
- Hotswap version
- Magnetic connector PCB
Layout Support:
Specification:
- Top case material: Aluminum (anodized/e-coating/RAW)
- Bottom case material: Aluminum/Copper/Stainless Steel (anodized/e-coating/RAW/textured/Sandblasted)
- Mounting style: Top Mount/PCB Gasket
- PCB: 1.6mm, 2 options, solder/Dual-mode hotswap
- Plate: Alu/Carbon fiber/PC/FR4 Plate
- Typing angle: 9 degree
- Weight bar: Aluminum with Anodized Copper, and Copper
- Designer: Wei
Kit Contents:
- Top case x1
- Bottom case x1
- Weight bars x1
- Daughterboard cover x1
- Silicone gasket x1 set
- Rubber feet x1 set
- PCB x1
- Daughterboard x1
- Optional foam kit x1 set
- Optional plate x1
QC Standard:
- Upon receipt, the casing is considered acceptable if all six external surfaces (top, bottom, left, right, front, and back) are free from machining marks, stains, dents, and pinholes, and do not have any black dots larger than 1mm or scratches longer than 1mm.
- The copper weight is considered acceptable if it does not have any black dots, pinholes, or blemishes larger than 1mm, and no scratches longer than 2mm.
- Flaws and manufacturing artifacts that do not affect the overall external appearance are considered reasonable. This includes, but is not limited to: minor blemishes around screw holes, uneven internal coating, hook marks (from anodizing/painting) where the base color is exposed, and water marks, tool marks, or scratches on internal surfaces. Purchasing this product means you accept these terms.
- Due to the significant weight difference between the top and bottom case parts, there may be slight color variations even when the same color is chosen for both.
-
Standards for RAW Finish
The RAW version is unanodized and uncoated. It preserves the original look of the machined metal, including natural tool marks.
Acceptable Quality Standards (Not covered by warranty):
1. Minor scratches, tool paths, and small speck-like imperfections.
2. Variations in surface reflection or slight dark spots on the raw metal.
(RAW products are not sold as "flawless." By purchasing, you acknowledge and accept the inherent characteristics of this manufacturing process.)
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